Electronic device

ABSTRACT

An electronic device includes a display panel, a fingerprint sensing unit and an integrated circuit, wherein the integrated circuit is for driving the display panel and the fingerprint sensing unit.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. provisional application No.62/842,537, filed on May 3, 2019, which is incorporated herein byreference.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to an electronic device, and moreparticularly to an electronic device having a display function and abiometric function (such as identification of a fingerprint and/or apalm print).

2. Description of the Prior Art

Generally, a biometric function (such as identification of a fingerprintand/or a palm print) may be used for identity identification. Nowadays,industries make effort integrating a sensor of the biometric feature inan electronic device, so as to advantage the yield rate and/or thecharacteristics of the electronic device.

SUMMARY OF THE DISCLOSURE

According to an embodiment, the present disclosure provides anelectronic device including a display panel, a fingerprint sensing unitand an integrated circuit, wherein the integrated circuit is for drivingthe display panel and the fingerprint sensing unit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram showing a cross-sectional view of anelectronic device according to a first embodiment of the presentdisclosure.

FIG. 2 is a schematic diagram showing a cross-sectional view of anelectronic device according to a second embodiment of the presentdisclosure.

FIG. 3 is a schematic diagram showing a cross-sectional view of anelectronic device according to a third embodiment of the presentdisclosure.

FIG. 4 is a schematic diagram showing a cross-sectional view of anelectronic device according to a fourth embodiment of the presentdisclosure.

FIG. 5 is a schematic diagram showing a cross-sectional view of anelectronic device according to a fifth embodiment of the presentdisclosure.

FIG. 6 is a schematic diagram showing a top view of a partial region ofFIG. 5.

FIG. 7 is a schematic diagram showing a cross-sectional view of anelectronic device according to a sixth embodiment of the presentdisclosure.

FIG. 8 is a schematic diagram showing a side view of the electronicdevice according to the sixth embodiment of the present disclosure.

FIG. 9 is a schematic diagram showing a cross-sectional view of anelectronic device according to a seventh embodiment of the presentdisclosure.

FIG. 10 is a schematic diagram showing a cross-sectional view of anelectronic device according to an eighth embodiment of the presentdisclosure.

FIG. 11 is a schematic diagram showing a top view of the electronicdevice before bent according to the eighth embodiment of the presentdisclosure.

FIG. 12 is a schematic diagram showing a cross-sectional view of anelectronic device according to a ninth embodiment of the presentdisclosure.

FIG. 13 is a schematic diagram showing a top view of the electronicdevice according to the ninth embodiment of the present disclosure.

FIG. 14 is a schematic diagram showing a top view of an electronicdevice according to a tenth embodiment of the present disclosure.

DETAILED DESCRIPTION

The present disclosure may be understood by reference to the followingdetailed description, taken in conjunction with the drawings asdescribed below. It is noted that, for purposes of illustrative clarityand being easily understood by the readers, various drawings of thisdisclosure show a portion of an electronic device in this disclosure,and certain elements in various drawings may not be drawn to scale. Inaddition, the number and dimension of each device shown in drawings areonly illustrative and are not intended to limit the scope of the presentdisclosure.

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willunderstand, electronic equipment manufacturers may refer to a componentby different names. This document does not intend to distinguish betweencomponents that differ in name but not function. In the followingdescription and in the claims, the terms “include”, “comprise” and“have” are used in an open-ended fashion, and thus should be interpretedto mean “include, but not limited to . . . ”. Thus, when the terms“include”, “comprise” and/or “have” are used in the description of thepresent disclosure, the corresponding features, areas, steps, operationsand/or components would be pointed to existence, but not limited to theexistence of one or a plurality of the corresponding features, areas,steps, operations and/or components.

The directional terms used throughout the description and followingclaims, such as: “on”, “up”, “above”, “down”, “below”, “front”, “rear”,“back”, “left”, “right”, etc., are only directions referring to thedrawings. Therefore, the directional terms are used for explaining andnot used for limiting the present disclosure. Regarding the drawings,the drawings show the general characteristics of methods, structures,and/or materials used in specific embodiments. However, the drawingsshould not be construed as defining or limiting the scope or propertiesencompassed by these embodiments. For example, for clarity, the relativesize, thickness, and position of each layer, each area, and/or eachstructure may be reduced or enlarged.

When the corresponding component such as layer or area is referred to“on another component”, it may be directly on this another component, orother component(s) may exist between them. On the other hand, when thecomponent is referred to “directly on another component (or the variantthereof)”, any component does not exist between them. Furthermore, whenthe corresponding component is referred to “on another component”, thecorresponding component and the another component have a dispositionrelationship along a top-view direction, the corresponding component maybe below or above the another component, and the dispositionrelationship along the top-view direction are determined by anorientation of the device.

It will be understood that when a component or layer is referred to asbeing “connected to” another component or layer, it can be directlyconnected to this another component or layer, or intervening componentsor layers may be presented. In contrast, when a component is referred toas being “directly connected to” another component or layer, there areno intervening components or layers presented. In addition, when thecomponent is referred to “be coupled to/with another component (or thevariant thereof)”, it may be directly connected to this anothercomponent, or may be indirectly connected (such as electricallyconnected) to this another component through other component(s).

The terms “about”, “substantially”, “equal”, or “same” generally meanwithin 20% of a given value or range, or mean within 10%, 5%, 3%, 2%,1%, or 0.5% of a given value or range.

Although terms such as first, second, third, etc., may be used todescribe diverse constituent elements, such constituent elements are notlimited by the terms. These terms are used only to discriminate aconstituent element from other constituent elements in thespecification, and these terms have no relation to the manufacturingorder of these constituent components. The claims may not use the sameterms, but instead may use the terms first, second, third, etc. withrespect to the order in which an element is claimed. Accordingly, in thefollowing description, a first constituent element may be a secondconstituent element in a claim.

It should be noted that the technical features in different embodimentsdescribed in the following can be replaced, recombined, or mixed withone another to constitute another embodiment without departing from thespirit of the present disclosure.

In the present disclosure, the electronic device may optionally includea display function, a sensing function, a touch sensing function, anantenna function, a light emitting function, other suitable function ora combination thereof, but not limited thereto. In some embodiments, theelectronic device may include a tiled device, but not limited thereto.The electronic device may include liquid crystal (LC) molecules, anorganic light-emitting diode (OLED), an inorganic light-emitting diode(LED) such as a micro-LED and/or a mini-LED, quantum dots (QDs)material, a quantum-dot light-emitting diode (QLED, QDLED), fluorescencematerial, phosphor material, other suitable material or a combinationthereof, but not limited thereto. Moreover, the electronic device (suchas display device) may include a color display panel or a monochromedisplay panel, and a shape of the electronic device may be a rectangle,a circle, a polygon, a shape having a curved edge or other suitableshape, but not limited thereto. In the following, in order to explainexemplarily, the electronic device includes a liquid crystal colordisplay panel as an example, but the electronic device is not limitedthereto. In some embodiments, the electronic device may include an OLEDdisplay panel, a LED display panel, a QLED display panel or othersuitable display panel.

Referring to FIG. 1, FIG. 1 is a schematic diagram showing across-sectional view of an electronic device according to a firstembodiment of the present disclosure. As shown in FIG. 1, the electronicdevice 100 may include an active region AR, wherein the active region ARmay optionally include a display region, a fingerprint sensing region, alight emitting region, a touch sensing region and/or a working regionbased on the use of the electronic device 100, but not limited thereto.For instance, the electronic device 100 shown in FIG. 1 includes aliquid crystal display panel, and the active region AR may include adisplay region DR of the liquid crystal display panel and a fingerprintsensing region FSR, but not limited thereto. Furthermore, in FIG. 1, forexample, the electronic device 100 may further include a peripheralregion PR of the liquid crystal display panel, and the peripheral regionPR may be adjacent to or surround the active region AR.

The display region DR of the electronic device 100 may include aplurality of pixels, and each pixel may include at least one sub-pixel.That is to say, the display region DR is a region containing lightemitting portions of all of the pixels for example. In some embodiments,for instance, one pixel may include three sub-pixels, such as a greensub-pixel, a red sub-pixel and a blue sub-pixel, but not limitedthereto. The number and the color of the sub-pixels included in thepixels may be changed based on requirement(s). The number of the pixels,the arrangement of the pixels, the number of the sub-pixels and thearrangement of the sub-pixels may be adjusted based on requirement(s).For instance, the sub-pixels may be arranged in matrix, stripe type,staggered type or any other suitable arrangement. In addition, thetop-view shape of the light emitting portion of the sub-pixel may be arectangle, a parallelogram, a chevron, a shape having a curved edge orother suitable shape. The top-view shape of the light emitting portionof the sub-pixel may be determined by an opening of a light shieldinglayer, and this content will be explained later.

As shown in FIG. 1, the electronic device 100 may include a firstsubstrate 110 and a second substrate 140, and the first substrate 110and the second substrate 140 are opposite and overlap with each otheralong a normal direction Dt of the first substrate 110. The firstsubstrate 110 and the second substrate 140 are connected by an adhesivestructure AL, such that a space where other components/structures may bedisposed is formed between the first substrate 110 and the secondsubstrate 140. The first substrate 110 and the second substrate 140 mayindividually include such as a rigid substrate, a soft substrate or aflexible substrate. The rigid substrate may include such as glass,quartz, ceramic, sapphire, other suitable material or a combinationthereof, but not limited thereto. The soft substrate and the flexiblesubstrate may include such as polyimide (PI), polyethylene terephthalate(PET), other suitable material or a combination thereof, but not limitedthereto. In some embodiments, the material of the first substrate 110and the material of the second substrate 140 may be the same ordifferent. In some embodiments, the first substrate 110 and the secondsubstrate 140 may be the rigid substrate or the flexible substrateindividually. In some embodiments, the first substrate 110 and thesecond substrate 140 are fixed by the adhesive structure AL, and theadhesive structure AL may include sealant and/or and other suitableadhesive material, but not limited thereto.

Note that, in some embodiments (as shown in FIG. 1), the display panel100D of the electronic device 100 may include the first substrate 110,the second substrate 140, the components/structures disposed on thefirst substrate 110 and the components/structures disposed on the secondsubstrate 140, but not limited thereto. In some embodiments, the displaypanel 100D of the electronic device 100 may include the first substrate110 and the components/structures disposed on the first substrate 110.In the following, some components and structures are described indetail, and the electronic device 100 may include a portion of them orall of them based on requirement(s).

As shown in FIG. 1, a display component layer 120 is disposed on aninner surface 110 a of the first substrate 110. The inner surface 110 afaces to the second substrate 140. Therefore, the display componentlayer 120 is disposed between the first substrate 110 and the secondsubstrate 140. The display component layer 120 may include at least oneconductive layer, at least one insulating layer, at least onesemiconductor layer, other layer or a combination thereof, so as to forma multi-layer structure. The display component layer 120 (e.g., themulti-layer structure) may include a plurality of display components 122contained in the sub-pixels, and the display component may be or mayinclude such as a light emitting component (e.g., any type oflight-emitting diode), a pixel electrode, a common electrode or othersuitable component. The material of the conductive layer may includemetal, transparent conductive material (such as indium tin oxide (ITO),indium zinc oxide (IZO), etc.), other suitable conductive material or acombination thereof. The material of the insulating layer may includesuch as silicon oxide (SiO_(x)), silicon nitride (SiN_(y)), siliconoxynitride (SiO_(x)N_(y)), polymethylmetacrylate (PMMA), other suitableinsulating material or a combination thereof. The material of thesemiconductor layer may include such as poly-silicon, amorphous silicon,metal-oxide semiconductor (e.g., IGZO), other suitable semiconductormaterial or a combination thereof, but not limited thereto.

The display component layer 120 can include a plurality of displayswitching components (not shown), and each display switching componentis electrically connected to the display component 122 of thesub-pixels. The display switching component may be a thin filmtransistor (TFT) or other suitable switch, wherein the type of the thinfilm transistor may be such as a top gate thin film transistor, a bottomgate thin film transistor, a dual gate thin film transistor or othersuitable transistor. Optionally, the display component layer 120 caninclude other electronic component (such as a capacitor, etc.). Theelectrical connections of the display components 122, the displayswitching components and other electronic component may be adjustedbased on designed requirement(s). As an example, one pixel electrode andone display switching component may be disposed in the sub-pixel of theliquid crystal display panel, and one capacitor may be optionallydisposed in the sub-pixel, but not limited thereto. As another example,in some embodiments (e.g., the electronic device 100 includes anothertype of the display panel), the circuit in the sub-pixel may include acircuit scheme containing two transistors and one capacitor or othersuitable circuit scheme.

The electronic device 100 may include a plurality of conductive lines,wherein each conductive line may include one conductive layer or moreconductive layers. In FIG. 1, the plurality of conductive lines mayinclude a plurality of first conductive lines T1 disposed on the innersurface 110 a of the first substrate 110, and each of the firstconductive lines T1 may be electrically connected to the component(s) inthe display component layer 120, such as the display component 122, thedisplay switching components and/or the capacitor, etc. In someembodiments, the plurality of conductive lines may further include aplurality of second conductive lines (not shown in figures) disposed onthe inner surface 110 a of the first substrate 110, and each of thesecond conductive lines may be electrically connected to thecomponent(s) in the display component layer 120, such as the displaycomponent 122, the display switching components and/or the capacitor,etc. In some embodiments, the first conductive line T1 may beelectrically connected to a terminal of the display switching component,such as a source (i.e., the first conductive line T1 may serve as adisplay data line), and the second conductive line may be electricallyconnected to another terminal of the display switching components, suchas a gate (i.e., the second conductive line may serve as a display scanline), but not limited thereto. In some embodiments, the firstconductive lines T1 may be substantially parallel to each other, thesecond conductive lines may be substantially parallel to each other, andthe first conductive lines T1 may not be parallel to the secondconductive lines. For instance, the first conductive lines T1 may beperpendicular to the second conductive lines substantially, but notlimited thereto.

In some embodiments, the first conductive line T1 may be formedsimultaneously with at least a part of one component in the displaycomponent layer 120, and/or the second conductive line may be formedsimultaneously with at least a part of one component in the displaycomponent layer 120. In some embodiments, the first conductive line T1and one terminal of the display switching component (e.g., the source)may be formed simultaneously by the same manufacturing process, and thesecond conductive line and another terminal of the display switchingcomponent (e.g., the gate) may be formed simultaneously by the samemanufacturing process, but not limited thereto. In some embodiments, thefirst conductive line T1 may be electrically connected to one terminal(e.g., the source) of the display switching component through aconnecting structure, and/or the second conductive line may beelectrically connected to another terminal (e.g., the gate) of thedisplay switching component through another connecting structure, butnot limited thereto.

Moreover, in some embodiments, the first conductive line T1 may beelectrically connected to the gate of the display switching component tobe the display scan line, and the second conductive line may beelectrically connected to the source of the display switching componentto be the display data line. That is to say, the terminal of the displayswitching component electrically connected to the first conductive lineT1 and the terminal of the display switching component electricallyconnected to the second conductive line may be exchanged, but notlimited thereto.

The electronic device 100 may include a fingerprint sensing componentlayer 130 configured to sense the biometric feature (for example, thefingerprint), wherein the disposed position of the fingerprint sensingcomponent layer 130 may be adjusted based on the requirement(s). In someembodiments (as shown in FIG. 1), the fingerprint sensing componentlayer 130 may be disposed on the second substrate 140, but not limitedthereto. In some embodiments (as shown in FIG. 1), the fingerprintsensing component layer 130 may be disposed on a surface of the secondsubstrate 140, which is opposite to the first substrate 110 and isreferred as an outer surface 140 b of the second substrate 140. That isto say, the second substrate 140 is disposed between the fingerprintsensing component layer 130 and the first substrate 110, but not limitedthereto. A size of the fingerprint sensing region FSR of the activeregion AR may be determined by the fingerprint sensing component layer130, wherein the fingerprint sensing region FSR may overlap or notoverlap the display region DR, and the size of the fingerprint sensingregion FSR may be greater than, less than or equal to the size of thedisplay region DR. For instance, in some embodiments (as shown in FIG.1), the fingerprint sensing region FSR may overlap the display regionDR, and the size of the fingerprint sensing region FSR may be equal tothe size of the display region DR, but not limited thereto. Moreover,the fingerprint sensing component layer 130 may include at least oneconductive layer, at least one insulating layer, at least onesemiconductor layer, any other suitable layer or a combination thereof,so as to form component(s) in the fingerprint sensing component layer130, wherein the material of the conductive layer, the material of theinsulating layer and the material of the semiconductor layer in thefingerprint sensing component layer 130 are similar to the displaycomponent layer 120, and thus, these contents will not be redundantlydescribed.

The fingerprint sensing component layer 130 may include at least onefingerprint sensing unit 132 serving as fingerprint sensor(s) to sensethe biometric feature (e.g., the fingerprint), thereby obtaining aprofile of the biometric feature (such as fingerprint ridges,fingerprint valleys and/or minutiae of the fingerprint). In the presentdisclosure, the type of the fingerprint sensor is not limited. Forinstance, the type of the fingerprint sensor may be a capacitivefingerprint sensor, an optical fingerprint sensor, an ultrasonicfingerprint sensor or a fingerprint sensor with other suitable type. Insome embodiments using the capacitive fingerprint sensor, thefingerprint sensing unit 132 may include such as an electrode, acapacitor or other suitable capacitor sensing unit, such that when thefingerprint sensing unit 132 senses, a capacitance of a correspondingregion of the biometric feature (e.g., the fingerprint) is obtained, andthe biometric feature identification may be processed according to thedifferences of the capacitances of all sensing regions (i.e., acapacitance corresponding to a fingerprint ridge region is differentfrom a capacitance corresponding to a fingerprint valley region), butnot limited thereto. In some embodiments using the optical fingerprintsensor, the fingerprint sensing unit 132 may include a PIN diode (havinga P-type semiconductor layer, an intrinsic layer and an N-typesemiconductor layer) or other suitable photoelectric conversion unit,and the biometric feature identification may be performed according tolight intensity of reflective light reflected from the biometric featureand received by the fingerprint sensing unit 132 during sensing period(e.g., the light intensities of the light reflected from the fingerprintridge and the light reflected from the fingerprint valley aredifferent), but not limited thereto. In some embodiments using theultrasonic fingerprint sensor, the fingerprint sensing unit 132 mayinclude such as an ultrasonic receiving generating unit, which includestwo electrodes and a piezoelectric layer sandwiched between these twoelectrodes, but not limited thereto. In the sensing process, a suitablevoltage difference may be applied on two electrodes of the ultrasonicreceiving generating unit to deform the piezoelectric layer (e.g., rapidvibration) for generating an ultrasonic wave, and the ultrasonic wavemay be reflected to be a reflective ultrasonic wave with correspondingintensity based on the profile of the biometric feature (e.g., theintensities of the reflective ultrasonic wave of the fingerprint ridgeand the reflective ultrasonic wave of the fingerprint valley aredifferent). Then, the piezoelectric layer of the ultrasonic receivinggenerating unit may correspondingly deform (e.g., rapid vibration) afterreceiving the reflective ultrasonic wave, thereby generating a voltagedifference between the two electrodes. Finally, the biometric featureidentification may be performed according to the differences of thegenerated voltage differences (the generated voltage differencecorresponding to the fingerprint ridge region is different from thegenerated voltage difference corresponding to the fingerprint valleyregion), but not limited thereto.

The fingerprint sensing component layer 130 may optionally include atleast one sensing switching component (not shown in FIG. 1) electricallyconnected to the fingerprint sensing unit 132. The connection betweenthe sensing switching component and the fingerprint sensing unit 132 maybe determined based on the sensing method and other requirement(s). Insome embodiments, the sensing switching component may be a thin filmtransistor or other suitable switching component. Furthermore, thefingerprint sensing component layer 130 may optionally include otherneeded electronic component.

In FIG. 1, the plurality of conductive lines may include a plurality ofthird conductive lines T3 disposed on the second substrate 140, and eachof the third conductive lines T3 is electrically connected to thecomponent(s) in the fingerprint sensing component layer 130, such as thefingerprint sensing unit 132 and/or the sensing switching component,etc. In some embodiments, the plurality of conductive lines may includea plurality of fourth conductive lines (not shown in figures) disposedon the second substrate 140, and each of the fourth conductive lines iselectrically connected to the component(s) in the fingerprint sensingcomponent layer 130, such as the fingerprint sensing unit 132 and/or thesensing switching component, etc. In some embodiments, the thirdconductive line T3 may be electrically connected to a terminal of thesensing switching component, such as a source (i.e., the thirdconductive line T3 may serve as a sensing data line), and the fourthconductive line may be electrically connected to another terminal of thesensing switching component, such as the gate (i.e., the fourthconductive lines may serve as a sensing scan line), but not limitedthereto. In some embodiments, the third conductive lines T3 may besubstantially parallel to each other, the fourth conductive lines may besubstantially parallel to each other, and the third conductive lines T3may not be parallel to the fourth conductive lines. For instance, thethird conductive lines T3 may be perpendicular to the fourth conductivelines substantially, but not limited thereto.

In some embodiments, the third conductive line T3 may be formedsimultaneously with at least a part of one component in the fingerprintsensing component layer 130, and/or the fourth conductive line may beformed simultaneously with at least a part of one component in thefingerprint sensing component layer 130. In some embodiments, the thirdconductive line T3 and one terminal (e.g., the source) of the sensingswitching component may be formed simultaneously by the samemanufacturing process, the fourth conductive line and another terminal(e.g., the gate) of the sensing switching component may be formedsimultaneously by the same manufacturing process, but not limitedthereto. In some embodiments, the third conductive line T3 may beelectrically connected to one terminal (e.g., the source) of the sensingswitching component through a connecting structure, and/or the fourthconductive line may be electrically connected to another terminal (e.g.,the gate) of the sensing switching component through another connectingstructure, but not limited thereto.

Moreover, in some embodiments, the third conductive line T3 may beelectrically connected to the gate of the sensing switching component tobe the sensing scan line, and the fourth conductive line may beelectrically connected to the source of the sensing switching componentto be the sensing data line. That is to say, the terminal of the sensingswitching component electrically connected to the third conductive lineT3 and the terminal of the sensing switching component electricallyconnected to the fourth conductive line may be exchanged, but notlimited thereto.

The electronic device 100 may include a needed circuit disposed on thefirst substrate 110 and/or the second substrate 140. In someembodiments, as shown in FIG. 1, the electronic device 100 may includeat least one integrated circuit (IC) 150 disposed on the peripheralregion PR of the first substrate 110, and the integrated circuit 150 iselectrically connected to the conductive lines to be coupled with otherelectronic component(s). In some embodiments, one integrated circuit 150may be one chip where the electronic components provided with differentfunctions are encapsulated. For example, the electronic component fordriving the display component 122 and the electronic component fordriving the fingerprint sensing unit 132 are encapsulated in one chip,but not limited thereto. In some embodiments, one integrated circuit 150may be electrically connected to the display components 122 and thefingerprint sensing units 132, so as to drive the display components 122in the display panel and drive the fingerprint sensing unit 132, therebycontrolling the display image and the fingerprint identification of theelectronic device 100 (i.e., this integrated circuit 150 may have afunction for controlling the display image and a function forcontrolling the fingerprint identification at the same time). In thiscase, since the number of the integrated circuit 150 may be reduced, thethickness of the electronic device 100 may be decreased and/or the sizeof the peripheral region PR of the electronic device 100 may bedecreased, but not limited thereto.

The first conductive line T1 may be electrically connected between theintegrated circuit 150 and the display switching component, such thatthe integrated circuit 150 may be electrically connected to the displaycomponent 122 through the first conductive line T1 and the displayswitching component in sequence, but not limited thereto. Moreover, inorder to make the integrated circuit 150 disposed on the first substrate110 be electrically connected to the fingerprint sensing unit 132 on thesecond substrate 140, the electronic device 100 may further include atleast one first connection line 160, and the first connection line 160extends from the inner surface 110 a of the first substrate 110 throughthe side surface 140 c of the second substrate 140 to the outer surface140 b of the second substrate 140, so as to be an electricallyconnecting path between the electronic component on the first substrate110 and the electronic component on the second substrate 140 (i.e., thefirst connection line 160 is a connection line between the electroniccomponents on two substrates respectively). In some embodiments, thefirst connection line 160 is outside the adhesive structure AL. Inaddition, the electronic device 100 may further include at least onefifth conductive line (not shown in FIG. 1) disposed on the innersurface 110 a of the first substrate 110. In some embodiments, at leasta portion of the fifth conductive line and at least a portion of thefirst conductive line T1 may be formed simultaneously by the samemanufacturing process, but not limited thereto. In some embodiments, thefirst conductive line T1 and the fifth conductive line belong todifferent conductive layers respectively. Regarding the electricalconnection between the integrated circuit 150 and the fingerprintsensing unit 132, in FIG. 1, the first connection line 160 is connectedbetween the fifth conductive line and the third conductive line T3, andthe fifth conductive line is connected between the integrated circuit150 and the first connection line 160. Therefore, the integrated circuit150 may be electrically connected to the fingerprint sensing unit 132through the fifth conductive line, the first connection line 160, thethird conductive line T3 and the sensing switching component insequence, but not limited thereto. As shown FIG. 1, the fingerprintsensing unit 132 may be electrically connected with the integratedcircuit 150 on the first substrate 110 through the first connection line160 (serving as a connection line) at the side surface 140 c of thesecond substrate 140. In some embodiments, the connection between thefifth conductive lines and the first connection lines 160 may beone-to-one, but not limited thereto. Note that, a pad may be optionallydisposed at an end of the third conductive line T3 to enhance anconnecting area between the first connection line 160 and the thirdconductive line T3, and pads may be optionally disposed at two ends ofthe fifth conductive line to enhance an connecting area between theintegrated circuit 150 and the fifth conductive line and a connectingarea between the first connection line 160 and the fifth conductiveline, thereby increasing the reliability of the electrical connection,but not limited thereto. In addition, the first connection line 160 isnot in contact with the first conductive line T1 directly.

Moreover, the first connection line 160 may include any suitableconductive material, such as transparent conductive material (e.g.,indium tin oxide and/or indium zinc oxide), metal, conductive adhesive(e.g., silver paste) or other suitable material or a combinationthereof, but not limited thereto. In some embodiments, a patterned firstconnection line 160 may be formed by printing, coating or adhering, butnot limited thereto. In addition, since the first connection line 160may be formed by printing, coating or adhering, the resolution (such asa line width) of the first connection line 160 may be restricted (forexample, the lower resolution and/or the greater line width).Accordingly, in some embodiments, the electronic device 100 mayoptionally include a demultiplexer (DEMUX) disposed on the secondsubstrate 140 and electrically connected between the third conductiveline T3 and the first connection line 160. Since the demultiplexer maymake one first connection line 160 provide signals for different thirdconductive lines T3 in different times, or make different thirdconductive lines T3 provide signals for one first connection line 160 indifferent times, the number of the first connection line(s) 160 may beless than the number of the third conductive lines T3. In someembodiments, the electronic device 100 may not have the demultiplexer,and the number of the first connection lines 160 may be equal to thenumber of the third conductive lines T3, but not limited thereto.

The electronic device 100 may optionally include another circuitdisposed on the second substrate 140. For instance, the electronicdevice 100 may optionally include a signal amplifying circuitelectrically connected to the third conductive line T3, so as to amplifythe sensing signal generated from the fingerprint sensing unit 132, butnot limited thereto. In some embodiments, this circuit or other circuitmay be integrated in the integrated circuit 150 having the function forcontrolling the fingerprint identification.

The circuits in the electronic device 100 may include a first gatedriving circuit disposed on the first substrate 110, and the first gatedriving circuit is electrically connected to the gates of the displayswitching components of the display component layer 120 through thesecond conductive lines, so as to drive the display switchingcomponents, but not limited thereto. In some embodiments, the first gatedriving circuit may be electrically connected to the gates of thedisplay switching components of the display component layer 120 throughthe first conductive lines T1. The circuits in the electronic device 100may optionally include a second gate driving circuit disposed on thesecond substrate 140, and the second gate driving circuit iselectrically connected to the gates of the sensing switching componentsof the fingerprint sensing component layer 130 through the fourthconductive lines, so as to drive the sensing switching component, butnot limited thereto. In some embodiments, the second gate drivingcircuit may be electrically connected to the gates of the sensingswitching components of the fingerprint sensing component layer 130through the third conductive lines T3.

In some embodiments, when the first substrate 110 is the soft substrateor the flexible substrate, a part of the first substrate 110 may befolded, so as to make at least a portion of the peripheral region PR befolded to such as the back of the active region AR or the back ofanother portion of the peripheral region PR (i.e., at least a portion ofthe peripheral region PR is folded downwardly in FIG. 1), therebyforming a front board portion and a back board portion. For instance, insome embodiment (not shown in figures), the integrated circuit 150disposed on the peripheral region PR may be folded downwardly, such thatthe integrated circuit 150 is disposed on the back board portion, butnot limited thereto. In this case, the size of the border of theelectronic device 100 may be reduced. Furthermore, in some embodiments,other component(s) of the electronic device 100, such as a battery, maybe disposed between the front board portion and the back board portionof the first substrate 110 after the first substrate 110 is bent, butnot limited thereto.

The electronic device 100 may further include any needed layer and/orstructure. In some embodiments, the electronic device 100 includes thedisplay panel 100D and a backlight module (not shown). The display panel100D can be a liquid crystal display panel, and the backlight module canbe disposed on a side of the first substrate 110 opposite to the secondsubstrate 140 (i.e., the first substrate 110 is disposed between thebacklight module and the second substrate 140). Note that, when thefirst substrate 110 is bent, the first substrate 110 may be optionallybent to a position below the backlight module, but not limited thereto.In some embodiments, the electronic device 100 may include a mediumlayer ML, and the medium layer ML includes such as a liquid crystallayer containing liquid crystal molecules. The medium layer ML isdisposed between the first substrate 110 and the second substrate 140,and the display component 122 may adjust the rotation of the liquidcrystal molecules of the liquid crystal layer based on the displaysignal, thereby controlling the transmittance of the backlight. Thedisplay component 122 can include a pixel electrode and a commonelectrode.

In some embodiments, the electronic device 100 may include the displaypanel 100D, and the electronic device 100 may further include a lightconverting layer (shown in the following figure), a light shieldinglayer (shown in the following figure), an optical layer, other suitablelayer or a combination thereof. The light shielding layer may have afunction of shielding light, and the light shielding layer may bedisposed on the first substrate 110 or the second substrate 140 based onrequirement(s). The light shielding layer may include such as blackphotoresist, black ink, black resin, pigment, dye, other suitablematerial or a combination thereof, and the light shielding layer may bea single-layer structure or a multi-layer structure. For instance, thelight shielding layer is configured to shield the lower components(e.g., the switching components and/or the conductive lines), or reducethe probability that the external light is reflected by the component(s)in the electronic device 100 (e.g., the switching components and/or theconductive lines), but not limited thereto. In some embodiments, thelight shielding layer has a plurality of openings, and each opening isconfigured to define the top-view shape of the sub-pixel. Therefore, thelight shielding layer may be configured to separate the sub-pixels. Insome embodiments, the light shielding layer may be configured todecrease the interference of the lights emitted from differentsub-pixels.

The light converting layer is disposed within the opening of the lightshielding layer, such that the light converting layer may becorresponding to one sub-pixel in the normal direction Dt. In someembodiments, compared with the component emitting the light (e.g., thelight emitting component or the backlight module), the light convertinglayer is more adjacent to a light-emitting surface of the electronicdevice 100, such that the light converting layer may convert the colorof the received light. In some embodiments, the light converting layermay include color filter, quantum dots (QD) material, fluorescencematerial, phosphorescence material, other suitable material or acombination thereof. Moreover, the light converting layers correspondingto different type sub-pixels may perform different light conversion. Forinstance, the light converting layer corresponding to the greensub-pixel may convert the incident light into the green light, the lightconverting layer corresponding to the red sub-pixel may convert theincident light into the red light, and the light converting layercorresponding to the blue sub-pixel may convert the incident light intothe blue light, but not limited thereto. In some embodiments, the lightconverting layer may have a function of scattering light. For example,the light converting layer may include a plurality of light scatteringparticles.

The optical layer may include such as an anti-reflection film, apolarizer, other suitable film or a combination thereof, and the opticallayer may be disposed at any suitable position. In some embodiments, theanti-reflection film may be disposed on the second substrate 140, butnot limited thereto. In some embodiments, the electronic device 100 mayinclude one or more polarizer(s), and each polarizer may be disposed onthe first substrate 110 or the second substrate 140.

The electronic device 100 may further include a circuit board (not shownin figures) configured to receive signals from outside, or to transmitsignals from the electronic device 100 to outside. For instance, in someembodiments, the circuit board may be bonded to the first substrate 110or the second substrate 140 by welding, such that the circuit board iselectrically connected to the electronic component (e.g., the integratedcircuit 150) on the first substrate 110 and/or the second substrate 140.In some embodiments, by such as welding or other suitable method, anouter connecting structure may be disposed on the circuit board andelectrically connected to the component(s) on the circuit board, suchthat the electronic device 100 may be electrically connected to an outerdevice through the circuit board and outer connecting structure on thecircuit board. In addition, the circuit board may be a rigid circuitboard, a soft circuit board or a flexible circuit board. In someembodiments, if the circuit board is the flexible circuit board, thecircuit board may be bent for reducing the size of the electronic device100.

The electronic device of the present disclosure is not limited to theabove embodiments. Further embodiments of the present disclosure aredescribed below. For ease of comparison, same components will be labeledwith the same symbol in the following. The following descriptions relatethe differences between each of the embodiments, and repeated parts willnot be redundantly described.

Referring to FIG. 2, FIG. 2 is a schematic diagram showing across-sectional view of an electronic device according to a secondembodiment of the present disclosure. As shown in FIG. 2, a differencebetween the first embodiment and this embodiment is that the fingerprintsensing component layer 130, the third conductive lines T3 and thefourth conductive lines of the electronic device 200 of this embodimentis disposed on an inner surface 140 a of the second substrate 140, whichis close to the first substrate 110. In other words, the fingerprintsensing component layer 130, the third conductive lines T3 and thefourth conductive lines are disposed between the second substrate 140and the first substrate 110. In addition, according to the design ofthis embodiment, the first connection line 160 may not need to extend tothe outer surface 140 b of the second substrate 140, but not limitedthereto. Note that, in FIG. 2, the third conductive line T3 iselectrically connected to the first connection line 160 at a positionclose to the side surface 140 c of the second substrate 140, but notlimited thereto.

Referring to FIG. 3, FIG. 3 is a schematic diagram showing across-sectional view of an electronic device according to a thirdembodiment of the present disclosure. As shown in FIG. 3, a differencebetween the second embodiment and this embodiment is that the firstconnection line 160 of the electronic device 300 of this embodiment mayextend inwardly to the inner surface 140 a of the second substrate 140,so as to increase the contact area between the first connection line 160and the third conductive line T3. In FIG. 3, the adhesive structure ALdoes not overlap the side surface 140 c of the second substrate 140 inthe normal direction Dt, such that a portion of the third conductiveline T3 is exposed outside the adhesive structure AL, so as to increasethe contact area between the first connection line 160 and the thirdconductive line T3.

Referring to FIG. 4, FIG. 4 is a schematic diagram showing across-sectional view of an electronic device according to a fourthembodiment of the present disclosure. As shown in FIG. 4, a differencebetween the second embodiment and this embodiment is that the electronicdevice 400 of this embodiment further includes an interconnectingelement 410 disposed on the side surface 140 c of the second substrate140, and the interconnecting element 410 is electrically connectedbetween the first connection line 160 and the third conductive line T3.For example, the connection between the interconnecting elements 410 andthe first connection lines 160 is one-to-one, but not limited thereto.In FIG. 4, for example, the first connection line 160 covers theinterconnecting element 410, but not limited thereto. Theinterconnecting element 410 may be any suitable conductive material,such as transparent conductive material (e.g., indium tin oxide and/orindium zinc oxide), metal (e.g., aluminum, gold and/or silver),conductive adhesive (e.g., silver paste) or other suitable material or acombination thereof, but not limited thereto. In some embodiments, thematerial of the interconnecting element 410 may be the same as ordifferent from the material of the first connection line 160. In someembodiments, the resistance of the material of the interconnectingelement 410 may be less than the resistance of the material of the firstconnection line 160. Furthermore, in some embodiments, theinterconnecting element 410 may be formed by printing, coating oradhering, but not limited thereto. In some embodiments, theinterconnecting element 410 may be formed by a semiconductor process,but not limited thereto. Since the interconnecting element 410 isbetween the first connection line 160 and the third conductive line T3,the effect of the electrical connection between the first connectionline 160 and the third conductive line T3 is enhanced (e.g., thereliability of the electrical connection is enhanced or the resistanceis reduced).

Referring to FIG. 5 and FIG. 6, FIG. 5 is a schematic diagram showing across-sectional view of an electronic device according to a fifthembodiment of the present disclosure, and FIG. 6 is a schematic diagramshowing a top view of a partial region of FIG. 5, wherein FIG. 5 showsthe sub-pixel SPX1, the sub-pixel SPX2, the sub-pixel SPX3, the displayswitching components 124, the sensing switching component 134, thefingerprint sensing unit 132, the light shielding layer LS, the lightconverting layer LT1, the light converting layer LT2 and the lightconverting layer LT3 described above, FIG. 6 shows the sub-pixel SPX1and the sub-pixel SPX2 in FIG. 5, and FIG. 6 correspondingly shows thefingerprint sensing unit 132, the sensing switching component 134 andthe light shielding layer LS shown in FIG. 5. As shown in FIG. 5 andFIG. 6, compared with the second embodiment shown in FIG. 2, FIG. 5 andFIG. 6 show more components and structures in the electronic device 500.In FIG. 5, the light shielding layer LS, the light converting layer LT1,the light converting layer LT2 and the light converting layer LT3 aredisposed on the inner surface 140 a of the second substrate 140, and thefingerprint sensing component layer 130 is disposed on the lightshielding layer LS, the light converting layer LT1, the light convertinglayer LT2 and the light converting layer LT3 (i.e., the fingerprintsensing component layer 130 is disposed between the light shieldinglayer LS and the first substrate 110), but not limited thereto. Thedisposition of the layers may be adjusted based on requirement(s). Insome embodiments, the fingerprint sensing component layer 130 may bedisposed on the inner surface 140 a of the second substrate 140, and thelight shielding layer LS, the light converting layer LT1, the lightconverting layer LT2 and the light converting layer LT3 are disposed onthe fingerprint sensing component layer 130 (i.e., the light shieldinglayer LS, the light converting layer LT1, the light converting layer LT2and the light converting layer LT3 are disposed between the fingerprintsensing component layer 130 and the first substrate 110), but notlimited thereto. In some embodiments, the light shielding layer LS, thelight converting layer LT1, the light converting layer LT2 and the lightconverting layer LT3 are disposed on the first substrate 110, but notlimited thereto. In addition, the electronic device 500 may optionallyinclude an insulating protective layer IPL, so as to protect the coveredcomponent(s) or structure(s), wherein the insulating protective layerIPL may cover the light shielding layer LS, the light converting layerLT1, the light converting layer LT2 and the light converting layer LT3.Moreover, the fingerprint sensing component layer 130 may furtherinclude a protective layer 136 covering the sensing switching component134, the fingerprint sensing unit 132 and/or the conductive line (e.g.,the third conductive line T3 and/or the fourth conductive line), but notlimited thereto. In some embodiments, the light shielding layer LS, thelight converting layers LT1˜LT3, the insulating protective layer IPL,and the fingerprint sensing component layer 130 are formed on the innersurface 140 a of the second substrate 140 in sequence, but not limitedthereto. The forming order may be adjusted based on the design of thelayer stack. Note that since the sub-pixel SPX1, the sub-pixel SPX2 andthe sub-pixel SPX3 in FIG. 5 emit the lights with different colorsrespectively, the light converting layers LT1˜LT3 may generate thelights with different colors.

In FIG. 5, the light shielding layer LS may overlap and shield thedisplay switching component 124, the sensing switching component 134,the conductive line and/or at least a portion of the fingerprint sensingunit 132 in the normal direction Dt, and the light converting layersLT1˜LT3 are disposed within the openings OP. In the top view of FIG. 6,the fingerprint sensing unit 132 and the sensing switching component 134are disposed around the light converting layer LT1, the light convertinglayer LT2 and the light converting layer LT3, and the sensing switchingcomponent 134 and at least a portion of the fingerprint sensing unit 132overlap the light shielding layer LS in the normal direction Dt.Furthermore, in some embodiments, the light shielding layer LS mayoptionally have a sensing opening (not shown in figures) exposing aportion of the fingerprint sensing unit 132, such that the fingerprintsensing unit 132 may receive such as a light, an electromagnetic wave ora sound wave through the sensing opening, but not limited thereto. Inaddition, the corresponding relation between the fingerprint sensingunits 132 and the sub-pixels, the density of the fingerprint sensingunits 132 and the number of the fingerprint sensing units 132 may beadjusted based on the practical sensing requirement. For instance, onefingerprint sensing unit 132 may correspond to one sub-pixel, moresub-pixels, one pixel, or more pixels, but not limited thereto. In FIG.6, one fingerprint sensing unit 132 corresponds to two sub-pixels (e.g.,the sub-pixel SPX1 and the sub-pixel SPX2), but not limited thereto.

Referring to FIG. 7 and FIG. 8, FIG. 7 is a schematic diagram showing across-sectional view of an electronic device according to a sixthembodiment of the present disclosure, and FIG. 8 is a schematic diagramshowing a side view of the electronic device according to the sixthembodiment of the present disclosure. As shown in FIG. 7 and FIG. 8, adifference between the second embodiment and this embodiment is that theintegrated circuit 150 and the fifth conductive lines T5 (as shown inFIG. 8) of the electronic device 600 of this embodiment may be disposedon a surface of the first substrate 110 opposite to the second substrate140 (this surface is referred as an outer surface 110 b of the firstsubstrate 110), such that the size of the electronic device 600 may bereduced. In order to make the integrated circuit 150 be electricallyconnected to the electronic component(s) on the second substrate 140(e.g., the fingerprint sensing unit 132 and the sensing switchingcomponent of the fingerprint sensing component layer 130), the firstconnection line 160 may extend from the side surface 140 c of the secondsubstrate 140 through the side surface 110 c of the first substrate 110to the outer surface 110 b of the first substrate 110, so as to beconnected to the fifth conductive line T5 disposed on the outer surface110 b of the first substrate 110. Thus, the electronic component on thesecond substrate 140 may be electrically connected to the integratedcircuit 150 through the first connection line 160 and the fifthconductive line T5.

In order to make the integrated circuit 150 be electrically connected tothe electronic component(s) disposed on another surface of the firstsubstrate 110 (e.g., the display component 122 and the display switchingcomponent of the display component layer 120 disposed on the innersurface 110 a of the first substrate 110), the electronic device 600 mayfurther include at least one second connection line 660, and the secondconnection line 660 extends from the side surface 110 c of the firstsubstrate 110 to the outer surface 110 b of the first substrate 110, soas to be electrically connected to the electronic component(s) on theinner surface 110 a of the first substrate 110 and the electroniccomponent(s) on the outer surface 110 b of the first substrate 110.Thus, the second connection line 660 may serve as a connection linebetween the electronic components respectively on two opposite surfacesof the first substrate 110. In some embodiments, the second connectionline 660 is outside the adhesive structure AL. Furthermore, referring toFIG. 7 and FIG. 8, the electronic device 600 may further include aplurality of sixth conductive lines T6 disposed on the outer surface 110b of the first substrate 110. In some embodiments, the fifth conductiveline T5 and the sixth conductive line T6 may be formed simultaneously bythe same manufacturing process, but not limited thereto. In someembodiments, the fifth conductive line T5 and the sixth conductive lineT6 belong to different conductive layers respectively. Regarding theelectrical connection between the integrated circuit 150 and thecomponent of the display component layer 120, in FIG. 7 and FIG. 8, thesecond connection line 660 is connected between the sixth conductiveline T6 and the first conductive line T1, the sixth conductive line T6is connected between the integrated circuit 150 and the secondconnection line 660. Therefore, the integrated circuit 150 may beelectrically connected to the display component 122 through the sixthconductive line T6, the second connection line 660, the first conductiveline T1 and the display switching component in sequence, but not limitedthereto. In some embodiments, the connection between the sixthconductive lines T6 and the second connection lines 660 may beone-to-one, but not limited thereto. Similarly, pads may be optionallydisposed at two ends of the sixth conductive line T6 to enhance anconnecting area between the integrated circuit 150 and the sixthconductive line T6 and an connecting area between the second connectionline 660 and the sixth conductive lines T6, thereby increasing thereliability of the connection, but not limited thereto.

Moreover, in FIG. 7, the first connection line 160 may inwardly extendto the inner surface 140 a of the second substrate 140, so as toincrease the connecting area between the first connection line 160 andthe third conductive line T3, but not limited thereto. Also, the secondconnection line 660 may inwardly extend to the inner surface 110 a ofthe first substrate 110, so as to increase the connecting area betweenthe second connection line 660 and the first conductive line T1, but notlimited thereto. In some embodiments, the third conductive line T3 maybe electrically connected to the first connection line 160 at a positionclose to the side surface 140 c of the second substrate 140, and thefirst conductive line T1 may be electrically connected to the secondconnection line 660 at a position close to the side surface 110 c of thefirst substrate 110, but not limited thereto.

In FIG. 8, the first connection lines 160 and the second connectionlines 660 may be arranged alternately, but not limited thereto. Thearrangement of the first connection lines 160 and the second connectionline 660 on the side surface may be designed based on requirement(s). Inaddition, the electronic device 600 may optionally include ainterconnecting element (such as the interconnecting element 410 shownin FIG. 4) disposed between the first connection line 160 and the thirdconductive line T3 and/or disposed between the first connection line 160and the fifth conductive line T5 and/or disposed between the secondconnection line 660 and the first conductive line T1 and/or disposedbetween the second connection line 660 and the sixth conductive line T6.

In some embodiments, the circuit board may be bonded to the innersurface 110 a or the outer surface 110 b of the first substrate 110, butnot limited thereto. Moreover, in some embodiments, if the electronicdevice 600 includes a backlight module (not shown), the integratedcircuit 150, the fifth conductive lines T5 and the sixth conductivelines T6 may be disposed on a surface of the backlight module away fromthe first substrate 110. Thus, the first connection line 160 may extendfrom the side surface 140 c of the second substrate 140 through the sidesurface 110 c of the first substrate 110 and a side surface of thebacklight module to the surface of the backlight module away from thefirst substrate 110, and the second connection line 660 may extend fromthe side surface 110 c of the first substrate 110 through the sidesurface of the backlight module to the surface of the backlight moduleaway from the first substrate 110. Accordingly, the integrated circuit150 may be electrically connected to other electronic component(s)through the conductive line(s) (the fifth conductive line T5, the sixthconductive lines T6, the first conductive line T1 and/or the thirdconductive line T3) and the connection line(s) (the first connectionline 160 and/or the second connection line 660). In this case, thecircuit board may be optionally bonded to the surface of the backlightmodule away from the first substrate 110, but not limited thereto.

Referring to FIG. 9, FIG. 9 is a schematic diagram showing across-sectional view of an electronic device according to a seventhembodiment of the present disclosure. As shown in FIG. 9, a differencebetween the first embodiment and this embodiment is that the fingerprintsensing component layer 130 of the electronic device 700 of thisembodiment is disposed on the first substrate 110. In FIG. 9, thefingerprint sensing component layer 130 is disposed on the displaycomponent layer 120, an insulating layer IL separates the fingerprintsensing component layer 130 and the display component layer 120, and theintegrated circuit 150 is electrically connected to the component(s) ofthe fingerprint sensing component layer 130 through the third conductivelines T3, but not limited thereto. In some embodiments, the material ofthe first conductive line T1 may be the same as or different from thematerial of the third conductive line T3. In some embodiments, thedisplay component layer 120 may be disposed on the fingerprint sensingcomponent layer 130, and the display component layer 120 is separatedfrom the fingerprint sensing component layer 130 by the insulating layerIL, but not limited thereto.

In some embodiments, the second substrate 140, the adhesive structure ALand the medium layer ML shown in FIG. 9 may be removed, such that theelectronic device 700 may be a structure having single substrate. Inthis case, the electronic device 700 may include an organic lightemitting diode display panel (OLED display panel), an inorganic lightemitting diode display panel (such as an LED display panel), aquantum-dot display panel or any other suitable display panel.

Referring to FIG. 10 and FIG. 11, FIG. 10 is a schematic diagram showinga cross-sectional view of an electronic device according to an eighthembodiment of the present disclosure, and FIG. 11 is a schematic diagramshowing a top view of the electronic device before bending according tothe eighth embodiment of the present disclosure, wherein FIG. 11 onlyshows some sub-pixels (the sub-pixel SPX1, the sub-pixel SPX2 and thesub-pixel SPX3) and some fingerprint sensing units 132 to make thefigure clear. As shown in FIG. 10, a difference between the seventhembodiment and this embodiment is that the first substrate 110 of theelectronic device 800 of this embodiment is a flexible substrate,wherein the bent first substrate 110 may be divided into a front boardportion 110F and a back board portion 110K, and the display componentlayer 120 and the fingerprint sensing component layer 130 are disposedon different portions of the first substrate 110 respectively. Forinstance, in FIG. 10, the display component layer 120 may be disposed onthe front board portion 110F of the first substrate 110, and thefingerprint sensing component layer 130 may be disposed on the backboard portion 110K of the first substrate 110, wherein the displaycomponent layer 120 may display the display image upwardly (i.e., thedisplay component layer 120 displays the display image along a directiontoward the second substrate 140 in FIG. 10), and the fingerprint sensingcomponent layer 130 may sense upwardly (i.e., the fingerprint sensingcomponent layer 130 senses along a direction toward the second substrate140 in FIG. 10) or downwardly (i.e., the fingerprint sensing componentlayer 130 senses along a direction away from the second substrate 140 inFIG. 10), but not limited thereto. Moreover, in FIG. 10, the integratedcircuit 150 may be disposed on the back board portion 110K of the firstsubstrate 110, but not limited thereto. In FIG. 10 and FIG. 11, the sizeof the display region DR may be the same as or different from the sizeof the fingerprint sensing region FSR. In addition, the correspondingrelation between the fingerprint sensing units 132 and the sub-pixels(the sub-pixel SPX1, the sub-pixel SPX2 and the sub-pixel SPX3), thedensity of the fingerprint sensing units 132 and the number of thefingerprint sensing units 132 may be designed based on requirement(s).

Referring to FIG. 12 and FIG. 13, FIG. 12 is a schematic diagram showinga cross-sectional view of an electronic device according to a ninthembodiment of the present disclosure, and FIG. 13 is a schematic diagramshowing a top view of the electronic device according to the ninthembodiment of the present disclosure, wherein FIG. 13 only shows somecomponents in the active region AR to make the figure clear. As shown inFIG. 12 and FIG. 13, a difference between the seventh embodiment andthis embodiment is that the electronic device 900 of this embodimentfurther includes a touch sensing component layer 910 to generate touchsensing signals to recognize a position or a motion of a touch element(e.g., a touch pen, finger(s), etc.). In some embodiments, the touchsensing component layer 910 may be disposed on the outer surface 140 bor the inner surface 140 a of the second substrate 140 (in FIG. 12, thetouch sensing component layer 910 is disposed on the inner surface 140 aof the second substrate 140), and the fingerprint sensing componentlayer 130 and the display component layer 120 may be disposed on thefirst substrate 110, but not limited thereto. A size of a touch sensingregion TR of the active region AR may be determined by the touch sensingcomponent layer 910, wherein the fingerprint sensing region FSR, thedisplay region DR and the touch sensing region TR may overlap or notoverlap, and the size of the touch sensing region TR may be greaterthan, less than or equal to the size of the display region DR. Forexample, in some embodiments (as shown in FIGS. 12 and 13), thefingerprint sensing region FSR, the display region DR and the touchsensing region TR may overlap, and the fingerprint sensing region FSR,the display region DR and the touch sensing region TR have the samesize, but not limited thereto. In addition, the touch sensing componentlayer 910 may include at least one conductive layer, any other suitablelayer or a combination thereof, so as to form a plurality of touchsensing units 912. For instance, the touch sensing unit 912 may be atransparent conductive electrode, but not limited thereto. In someembodiments, the touch sensing unit 912 may use a capacitive method tosense; for instance, the touch sensing unit 912 may be aself-capacitance sensing unit or a mutual-capacitance sensing unit, butnot limited thereto. In some embodiments, the touch sensing unit 912 mayuse any other suitable method to sense. Furthermore, in someembodiments, the electronic device 900 may include an in-cell touchdisplay panel. In other words, the touch sensing unit 912 may serve assuch as a common electrode during a display period, and perform thetouch sensing function during a touch sensing period.

The plurality of the conductive lines of the electronic device 900 mayfurther include a plurality of seventh conductive lines T7 disposed onthe second substrate 140, and each of the seventh conductive lines T7 iselectrically between the integrated circuit 150 disposed on the firstsubstrate 110 and the touch sensing unit 912. Note that the number ofthe integrated circuit 150 and the function of the integrated circuit150 may be designed based on requirement(s). In some embodiments, theelectronic device 900 may include one integrated circuit 150 having afunction for controlling the display image, a function for controllingthe fingerprint identification and a function for controlling the touchsensing. Thus, this integrated circuit 150 may be electrically connectedto and drive the display components 122, the fingerprint sensing units132 and the touch sensing units 912, but not limited thereto.

In FIG. 12, in order to make the touch sensing unit 912 disposed on thesecond substrate 140 be electrically connected to the integrated circuit150 disposed on the first substrate 110, the first connection line 160is electrically connected between the touch sensing unit 912 and theintegrated circuit 150. Furthermore, in FIG. 12, the plurality of theconductive lines of the electronic device 900 may further include aplurality of eighth conductive lines (not shown in figures) disposed onthe inner surface 110 a of the first substrate 110, wherein the firstconnection line 160 is connected between the seventh conductive line T7and the eighth conductive line, and the eighth conductive line isconnected between the first connection line 160 and the integratedcircuit 150, such that the integrated circuit 150 may be electricallyconnected to the touch sensing unit 912 through the eighth conductiveline, the first connection line 160 and the seventh conductive line T7in sequence. That is to say, the touch sensing unit 912 is electricallyconnected to the integrated circuit 150 through the first connectionline 160 on the side surface 140 c of the second substrate 140. In someembodiments (as shown in FIG. 12), the eighth conductive line and atleast a part of the first conductive line T1 may be formedsimultaneously by the same manufacturing process, and/or the eighthconductive line and at least a part of the third conductive line T3 maybe formed simultaneously by the same manufacturing process, but notlimited thereto. In some embodiments, the first conductive line T1, thethird conductive line T3 and the eighth conductive line belong todifferent conductive layers. In some embodiments, the connection betweenthe eighth conductive lines and the first connection lines 160 may beone-to-one, but not limited thereto. Note that, a pad may be optionallydisposed at an end of the seventh conductive line T7 to enhance aconnecting area between the first connection line 160 and the seventhconductive line T7. In an embodiment, pads may be optionally disposed attwo ends of the eighth conductive line to enhance an connecting areabetween the integrated circuit 150 and the eighth conductive line and anconnecting area between the first connection line 160 and the eighthconductive line, thereby increasing the reliability of the electricalconnection, but not limited thereto. In addition, a needed circuit maybe optionally disposed between the first connection line 160 and theseventh conductive lines T7, and this circuit may be such as a signalamplifying circuit and/or a demultiplexer, but not limited thereto. Notethat, in order to make the figure clear, FIG. 12 omits an insulatinglayer between the first connection line 160 and the third conductiveline T3. In other words, in FIG. 12, the first connection line 160 isnot in contact with the third conductive line T3 directly. Furthermore,the first connection line 160 is not in contact with the firstconductive line T1 directly.

The disposition of the display component layer 120, the fingerprintsensing component layer 130 and the touch sensing component layer 910may be adjusted based on designed requirement(s), and the disposed orderis not limited by the above content. In some embodiments (not shown infigures), on the first substrate 110, the display component layer 120may be disposed on the fingerprint sensing component layer 130, and thedisplay component layer 120 and the fingerprint sensing component layer130 are separated by the insulating layer IL, but not limited thereto.In some embodiments (not shown in figures), the position of the touchsensing component layer 910 and the position of the fingerprint sensingcomponent layer 130 may be exchanged (i.e., the fingerprint sensingcomponent layer 130 is disposed on the second substrate 140, and thetouch sensing component layer 910 and the display component layer 120are disposed on the first substrate 110), but not limited thereto. Insome embodiments (not shown in figures), the display component layer120, the fingerprint sensing component layer 130 and the touch sensingcomponent layer 910 are disposed on the first substrate 110, and thedisplay component layer 120, the fingerprint sensing component layer 130and the touch sensing component layer 910 may overlap or may notoverlap. The stacking order of the display component layer 120, thefingerprint sensing component layer 130 and the touch sensing componentlayer 910 may be changed based on designed requirement(s). For instance,in some embodiments, the display component layer 120, the fingerprintsensing component layer 130 and the touch sensing component layer 910may be stacked in sequence; in some embodiments, the fingerprint sensingcomponent layer 130 and the touch sensing component layer 910 may bedisposed on the display component layer 120, but the fingerprint sensingcomponent layer 130 is disposed on a side of the touch sensing componentlayer 910, and the fingerprint sensing component layer 130 does notoverlap the touch sensing component layer 910, but not limited thereto.

In FIG. 12 and FIG. 13, in the normal direction Dt, one touch sensingunit 912 may be corresponding to a plurality of the fingerprint sensingunits 132 and a plurality of the sub-pixels (a plurality of the displaycomponents 122), which include the sub-pixel(s) SPX1, the sub-pixel(s)SPX2 and/or the sub-pixel(s) SPX3. In some embodiments, the fingerprintsensing unit 132 does not overlap the sub-pixel SPX1, the sub-pixel SPX2and the sub-pixel SPX3 (the display components 122) in the normaldirection Dt, but not limited thereto. In FIG. 13, one fingerprintsensing unit 132 may correspond to one sub-pixel in the top view, butnot limited thereto. Moreover, as shown in FIG. 13, the first conductivelines T1, the third conductive lines T3 and the seventh conductive linesT7 may be substantially parallel to each other, but not limited thereto.The extending direction of the conductive line may be adjusted based ondesigned requirement(s). For example, these conductive lines may overlapin the normal direction Dt and/or not be parallel to each other.

Referring to FIG. 14, FIG. 14 is a schematic diagram showing a top viewof an electronic device according to a tenth embodiment of the presentdisclosure, wherein FIG. 14 only shows some components in the activeregion AR, so as to make the figure clear. As shown in FIG. 14, adifference between the ninth embodiment and this embodiment is thedisposition of the regions in the active region AR of the electronicdevice 1000 of this embodiment. The display region DR overlap the touchsensing region TR in the normal direction Dt, and the fingerprintsensing region FSR does not overlap the touch sensing region TR and thedisplay region DR in the normal direction Dt. That is to say, thefingerprint sensing unit 132 does not overlap the touch sensing unit 912and the display component 122 (the sub-pixel SPX1, the sub-pixel SPX2and the sub-pixel SPX3) in the normal direction Dt, but not limitedthereto. In FIG. 14, the fingerprint sensing unit 132 is disposed on aside of the touch sensing unit 912 and the display component 122 (thesub-pixel SPX1, the sub-pixel SPX2 and the sub-pixel SPX3), but notlimited thereto.

In summary, according to some embodiments, the electronic deviceincludes the display function and the biometric function (such asidentification of the fingerprint and/or the palm print), and mayoptionally include the touch sensing function. In some embodiments, theintegrated circuit has multiple functions that can drive the displaypanel and the fingerprint sensing unit, so as to decrease the number ofthe integrated circuit(s). In some embodiments, the electronic devicemay have the connection line(s) on the side surface of the substrate,such that the electronic components disposed on different substrates maybe electrically connected to each other.

Although the embodiments and their advantages of the present disclosurehave been described as above, it should be understood that any personhaving ordinary skill in the art can make changes, substitutions, andmodifications without departing from the spirit and scope of the presentdisclosure. In addition, the protecting scope of the present disclosureis not limited to the processes, machines, manufactures, materialcompositions, devices, methods and steps in the specific embodimentsdescribed in the description. Any person having ordinary skill in theart can understand the current or future developed processes, machines,manufactures, material compositions, devices, methods and steps from thecontent of the present disclosure, and then, they can be used accordingto the present disclosure as long as the same functions can beimplemented or the same results can be achieved in the embodimentsdescribed herein. Thus, the protecting scope of the present disclosureincludes the above processes, machines, manufactures, materialcompositions, devices, methods and steps. Moreover, each claimconstitutes an individual embodiment, and the protecting scope of thepresent disclosure also includes the combination of each claim and eachembodiment. The protecting scope of the present disclosure shall bedetermined by the appended claims.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the disclosure. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. An electronic device, comprising: a displaypanel; a fingerprint sensing unit; and an integrated circuit for drivingthe display panel and the fingerprint sensing unit.
 2. The electronicdevice according to claim 1, further comprising a touch sensing unit,wherein the integrated circuit is additionally for driving the touchsensing unit.
 3. The electronic device according to claim 2, wherein thedisplay panel comprises a first substrate on which the fingerprintsensing unit, the touch sensing unit and the integrated circuit aredisposed.
 4. The electronic device according to claim 2, wherein thedisplay panel comprises: a first substrate on which the fingerprintsensing unit and the integrated circuit are disposed; and a secondsubstrate which overlaps with the first substrate and on which the touchsensing unit is disposed.
 5. The electronic device according to claim 4,wherein the touch sensing unit is electrically connected with theintegrated circuit at a side surface of the second substrate through aconnection line.